1. Traditional measurement methods

2. Modern measurement methods

With the advancement of technology, modern measurement methods have made breakthrough progress in measuring copper thickness on circuit boards, mainly including X-ray diffraction, SEM, and EDX methods.

X-ray diffraction is currently one of the most widely used methods for measuring copper thickness on circuit boards. This method accurately measures the thickness of copper foil through its radiation transmission and scattering characteristics. Its measurement results have high accuracy and are not affected by human factors, making it one of the most commonly used methods in the modern electronic manufacturing industry.

The combination of SEM (scanning electron microscope) and EDX (energy dispersive X-ray spectrometer) is also a relatively accurate method for measuring copper thickness on circuit boards. This method determines the thickness of copper foil by observing its surface morphology and composition, combined with energy spectrum analysis. This method does not require contact with the sample and the measurement process can be displayed in real-time, greatly improving the efficiency and accuracy of the measurement.

-IPC-6012: Standard requirements for multi-layer circuit boards and rigid circuit boards have been released, including requirements for copper foil thickness.
-JISC61022: A standard for rigid communication circuit boards issued by the Japan Industrial Standards Committee, which includes requirements for copper foil thickness.
-GB/T4677: The standard for communication circuit boards issued by the National Standardization Administration of China includes requirements for copper foil thickness.