Uniwell Circuits provides customized production services for a variety of 12 layers circuit boards, covering various high-end process types such as high-frequency and high-speed, (high-density interconnect), back drilling, and quad lamination mixed pressing, suitable for electronic device application scenarios that require high performance and reliability.
Main 12 layers circuit board product types and technical characteristics:
12 layers HDI (2+8+2) module product
Using R5775G (HVLP) material, it has a fine line width and spacing of 2.5/2.5mil, an inner space of 5ml, and a surface treatment of 50 μ "electroplated gold, suitable for high-density wiring and miniaturization design requirements.
12 layers back drilling plate
The board thickness is up to 5.0mm, the minimum aperture is 0.3mm, and the thickness to diameter ratio is as high as 17:1. It is suitable for scenarios where signal reflection and crosstalk are suppressed in high-speed signal transmission, such as communication equipment and server motherboards.
12 layers four fold laminated composite board
Using RO4003C+RO4450F+high TG material for mixed compression design, supporting high-frequency and high-speed applications, with an inner space of 0.17mm, suitable for environments with complex multi-layer structures and high thermal stability requirements.
12th floor FR-4 high-rise board
The standard board thickness is 2.5mm, the minimum line width is 5ml, the inner and outer copper thickness is 1oz, and the surface treatment is gold-plated. It has good mechanical strength and electrical performance and is widely used in industrial control, power modules and other fields.